您現在的位置:首頁 > 產品中心 > EEPROM > SPI EEPROM

    Related Products

    Known Good Die(KGD)

    Known Good Die (KGD) product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement....


    Wafer-Level Chip Scale Package(WLCSP)

    Wafer-Level Chips Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options.The die size of Puya products has leading competitiveness,so Puya WLCSP is a true chip-scale package.Puya provides WLCSP SPI NOR Flash,IIC EEPROM&VCN Driver products for mobile or portable form factor applications, such as 3D-CCM,digital cameras,smart watches,GPS navigation device,etc.


    Copyright ◎ 2018 普冉半導體(上海)股份有限公司 All Rights Reserved. 滬ICP備18003292號-1 滬公網安備?31011502015234號